Upcoming Snapdragon 8 Gen 3 revealed to arrive with two variants- TSMC 4nm and 3nm process

Qualcomm will be hosting the Snapdragon Summit from October 24-October 26 in Hawaii and recently it was revealed that the company will be launching the highly anticipated and much awaited Snapdragon 8 Gen 3 in the same summit. It is said that smartphones like Realme GT 5, Xiaomi 14 Pro, Honor Magic 6 Ultimate, Redmi K70 series, OnePlus 12 and Vivo X100 series could be powered with this upcoming chipset.

Now ahead of the official launch of Snapdragon 8 Gen 3, an interesting update has been revealed about this chipset. South Korean blog site gamma0burst, has recently shared the leaked email conversations between Qualcomm and it’s smartphone partners like Samsung that reveal Qualcomm stating that the upcoming Snapdragon 8 Gen 3 chipset will be available in two variants- one manufactured on TSMC’s 4nm N4P node process as recently revealed and other variant manufactured on TSMC’s 3nm N3E node process.

The leaked document also reveal that the upcoming chipset will be using ARM’s latest Cotex X4, Cortex A720 and Cortex A520 CPU cores.

Previously in the year 2022, the company has done the same thing when it introduced Snapdragon 8 Gen 1 and Snapdragon 8+ Gen 1 chipsets. The difference between these SoCs was the node process on which they were manufactured on. Seems like Qualcomm is going to repeat the history once again.

It will be interesting to see that what difference will be in the performance and power efficiency of both the variants of Snapdragon 8 Gen 3 and whether the upcoming variants will be named Snapdragon 8 Gen 3 and Snapdragon 8+ Gen 3 or not?