Qualcomm’s Snapdragon 8 Gen 3 Chipset to Come with 2+3+2+1 Next Gen Arm Cores: Here’s What We Know
Based on leaked information, it has been confirmed that Qualcomm’s latest Snapdragon 8 Gen 3 chipset will have a 2+3+2+1 architecture with next-gen Arm cores equipped within it.
Here’s more about it.
Qualcomm’s Snapdragon 8 Gen 3 Chipset expected specs
Reports are now revealing that the latest chipset from Qualcomm, the upcoming Snapdragon 8 Gen 3 chipset will have an architecture with 2+3+2+1 next-gen Arm cores. The chipset will also be integrated with the Adreno 750 GPU as well.
As per what is now known, the octa-core chipset will have two Arm cores codenamed Hayes (A5xx)”silver”, three Arm cores codenamed Hunter(A7xx)”gold”, two Arm cores codenamed Hunter(A7xx)”titanium” and an Arm core which is codenamed Hunter ELP(Xn)”gold+”.
The Qualcomm chipset with the codename “Lanai” will be the first to introduce a “titanium” cluster into the chipset. It seems that the titanium cores might be configured in a different way than the other cores with probably more cache or maybe with a higher clock speed. However, the details regarding how the titanium cores will be configured and how they will perform can only be confirmed with further updates.
The Arm cores codenamed Hayes and Hunter(ELP) are cores that are being newly introduced to Qualcomm chipsets. Reports also reveal that the Snapdragon 8 Gen 3 will be a 64-bit chipset. The chipset as mentioned will also be equipped with the Adreno 750 GPU which has a max frequency of 770 MHz, however, it can change with more revisions that are to be made to the chipset in the future.
The upcoming Qualcomm Snapdragon 8 Gen 3 chipset is also expected to run on Linux kernel 6.1 along with the Android 14 operating system.
🐉 Qualcomm Snapdragon 8 Gen 3 to come with 2+3+2+1 next-gen Arm cores, Adreno 750, more: leak 🧵 pic.twitter.com/TAYu8GsDto
— Kuba Wojciechowski :3 (@Za_Raczke) March 23, 2023
With more updates in the future, we’ll be able to know more about the cores and which smartphone will be the first to bring the chipset onboard.
